POWER MODULOS Pressing Home the Advantages

EXCELENTE ARTIGO DA REVISTA BODOPOWER SYSTEM
Pressing Home the Advantages
Press-Fit pin for solder-less assembly
Solder pins have been the interface of choice for power modules for many years. The new
press-fit pin developed by Vincotech takes the assembly properties of Vincotech power
modules a step further: the solder-less assembly of the modules, equally easy on both
sides of the PCB, leads to higher reliability and design flexibility and drastically reduces
production costs.
By Peter Sontheimer, Vincotech

The target: faster and easier assembly
Common inverter construction today features large Through The Hole
(TTH) components along with smaller SMD devices on one side of
the PCB, with the power module mounted on the other side and connected
to the heat sink (see fig 1). Only in exceptional cases, where
space allows and where special heat sink shapes are possible, the
power module is mounted on the same side as all other components.
This means that wave-soldering of the power module is not possible.
The solution most usually adopted in these cases is either a manual
solder process, which immediately raises questions regarding reliability
and production efficiency, or selective robot soldering, entailing the
same production efficiency issues as well as higher costs.