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quarta-feira, 5 de agosto de 2026

Effects of Flat-Core Geometry on Magnetic Flux Distribution and Thermal Behavior in Integrated Transformers for High-Frequency LLC Converters- Journal of Electrical Engineering & Technology-BY-Jun-Taek Oh · Taek-Keun Jung · Jong-Soo Kim


 

Effects of Flat-Core Geometry on Magnetic Flux Distribution and Thermal Behavior in Integrated Transformers for High-Frequency LLC Converters Jun-Taek Oh1 · Taek-Keun Jung1 · Jong-Soo Kim1 Received: 18 November 2025 / Revised: 12 April 2026 / Accepted: 27 April 2026 / Published online: 22 May 2026
 © The Author(s) under exclusive licence to The Korean Institute of Electrical Engineers 2026

 Abstract This study investigates the thermal behavior of an integrated transformer structure that incorporates a flat core to expand the flux-sharing area. Using electromagnetic analysis based on Ansys Maxwell, the characteristics of magnetic flux distribution and core temperature rise are analyzed, and the magnetic flux density and thermal behavior are compared according to the presence of the resonant inductor core and variations in flat-core thickness. In addition, the characteristics of flux overlap and saturation according to the direction of flux flow are analyzed. Based on these analyses, an optimized integrated transformer design is proposed to effectively mitigate heat generation and magnetic flux saturation. To verify the feasibility of this design, a 500-kHz LLC resonant converter prototype was built, and experiments were conducted at approximately 3.1 kW in the resonant frequency region. The results show that the optimized design reduces core temperature rise by up to 95.8 °C compared with a conventional design that does not consider flat-core thickness and integrated transformer geometry, while also improving overall system efficiency by 0.7%. These findings demonstrate the effectiveness of the flat-core-based integrated transformer design in high-frequency, high-power-density power conversion systems and highlight its potential applicability to future highly integrated power electronic systems.


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