Simulation software to calculate heatsink.

SemiSimV1 is a Powerful simulation and calculation program for power electronics.
The simulation program consists of the following modules:
Mod1: power loss calculation for buck and boost converters, 3-phase inverters and Indirect Matrix Converter.
Customer-specific adaptations are possible.
Mod2: temperature of the silicon and lifetime calculations for defined load cycles
Mod3: Thermal resistance and thermal conductivity of VIA's and PCBs in different lay-out
Mod4: Heatsink calculation, heat resistance and heat transfer coefficient calculation of heat sinks in natural convection and active.
Mod5: 2-D simulation of heat sink temperature in accordance with the heat spreading and thermal conductivity of heat sink.
Heat sink temperature calculated
Database for the collection of IGBT, MOSFET, diode and thyristor data

Be determined for a long life and reliable operation of power electronics, the semiconductor temperature. In many cases, a heat sink is used for cooling. Be known for the determination of the semiconductor temperature, the temperature of the heatsink.
The heat sources are usually not distributed homogeneously on the heatsink. Thus, the heat distribution as a function of the position of the heat sources can be simulated.
There are excellent simulation programs to perform the calculation based on the finite element method. This is often drawn a 3-Dimensional Model of the heat sink. The model is divided into a corresponding number of elements. The result deserting method is very accurate.
The disadvantage is the high complexity and high cost of such programs.
Another important point is the correct value for the thermal resistance (heat resistance) of the heatsink. This value is dependent on the geometry, imprinted on the type of cooling or dissipation of the heat sink is. This value is not found in the data sheets of manufacturers, as it depends on the previously described parameters.
SemiSimV1 the Modul4 and Modul5 is a very inexpensive program that allows a first estimation of the temperature distribution and heat sink temperature. The required thermal resistance of heat sink can be calculated quickly and easily.
The program does not provide the exact dates of a "Finite Element Simulation", however, allows the developer from the beginning of the heat sink to calculate and simulate the temperature of the heat sink.

Ceramic Heatsink Provides Innovative ThermalManagement

A new ceramic technology offers an innovative solution for thermally sensitive components and circuits,
thanks to its excellent thermal conductivity and stability characteristics and its compact form. CeramCool is
the ideal heatsink for high-power semiconductors where it demonstrates its ability to handle high power
peaks. Alfred Thimm, Service Center Design, CeramTec AG, Plochingen, Germany