Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods-Deivid F. de Souza1,∗, Diego S. Greff11Federal University of Santa Catarina, PPGESE, Joinville, SC, Brazil

 

Eletronica de Potencia, Rio de Janeiro, v. 30, e202510, 2025 Thermoelectric Characterization of IGBT Power Modules: An Approach by Static and Dynamic Methods-Deivid F. de Souza1,∗, Diego S. Greff11Federal University of Santa Catarina, PPGESE, Joinville, SC, Brazil

 ABSTRACTThis study evaluates IGBT modules with a focus on efficiently measuring their thermalimpedance, a critical factor in reliability assessments. The research employs the Thermo Electric SensitiveParameter method to measure the Virtual Junction Temperature and obtain the Thermal Impedancecurve. These experimental results are compared with datasheet values, using power modules without abaseplate. Two methodologies, dynamic and static, are utilized, both demonstrating consistent performancein evaluating thermal characteristics. The study also addresses the importance of accounting for non-linearity in thermal conductance due to temperature dependency, which is essential for accurate thermalcharacterization. Additionally, it explores the potential for measuring the Thermal Impedance betweenJunction and Case in power modules without a baseplate, offering a comprehensive understanding ofthermal performance.

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